[期刊论文] |
来源:CSI Transactions on ICT. 2019 ;7(3):221-225.doi:10.1007/s40012-019-00240-z
出版社:Springer Nature
[期刊论文] |
来源:Journal of Computational Electronics. 2019 ;18(4):1182-1191.doi:10.1007/s10825-019-01382-8
出版社:Springer Nature
[期刊论文] |
来源:Journal of Computational Electronics. 2017 ;16(3):658-665.doi:10.1007/s10825-017-1011-x
出版社:Springer Nature
[期刊论文] |
来源:Superlattices and Microstructures. 2017 ;109:805-814.doi:10.1016/j.spmi.2017.06.001
出版社:Elsevier BV
[期刊论文] |
来源:Microelectronics Reliability. 2022 ;131:114512.doi:10.1016/j.microrel.2022.114512
出版社:Elsevier BV
[期刊论文] |
来源:International Journal of VLSI Design & Communication Systems. 2012 ;3(1).
出版社:Academy & Industry Research Collaboration Center (AIRCC)
[期刊论文] |
来源:International Journal of Electronics. 2019 ;106(11):1617-1631.doi:10.1080/00207217.2019.1600744
出版社:Taylor & Francis Group
[期刊论文] |
来源:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields. 2018 ;31(3).doi:10.1002/jnm.2304
出版社:John Wiley & Sons, Ltd.
[期刊论文] |
来源:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields. 2018 ;31(5).doi:10.1002/jnm.2320
出版社:John Wiley & Sons, Ltd.