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来源:Journal of Semiconductors. 2016 ;37(3):035001.doi:10.1088/1674-4926/37/3/035001
出版社:IOP Publishing
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出版社:Engg Journals Publications
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来源:International Journal of Engineering and Technology. 2017 ;9(3S):432-441.doi:10.21817/ijet/2017/v9i3/170903S067
出版社:Engg Journals Publications
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