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Freestanding microstructures are widely used as components in micro-electro-mechanical systems (MEMS) applications or its functions as a microdevice itself. Microfabrication techniques and materials were originally borrowed from the integrated circuit industry; but nowadays, various microfabrication techniques for producing multi-dimensional microstructures are developed with lots of available alternative materials. To obtain freestanding microstructures for assembling MEMS devices, sacrificial layer and release techniques are developed to release the fabricated microcomponents from substrate. This review presents a detailed description of current existing microfabrication and release techniques, fabrication structural and sacrificial material, and achieved multi-dimensional microstructures.
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