[期刊论文][research article]


On the origin, physical basis and numerical stability of creep life equations

作   者:
VITO Cedro III;

出版年:2023

页     码:492 - 505
出版社:Taylor And Francis


摘   要:

ABSTRACT In this paper several aspects of single line minimum creep rate and time to rupture models are examined that have not been discussed previously in the literature the origin and boundary condition behaviour of some models; and the existence and relevance (for industrial applications) of temperature turnback. It is found that some published time to rupture models will predict very finite times to rupture at zero stress and temperatures of industrial use of the alloys, and that temperature turnback is mathematically possible even with physics-based models, but unlike stress turnback, the conditions at which temperature turnback would occur are usually of no physical or industrial relevance.



关键字:

Creep;creep life equations;Monkman Grant equation;stress and temperature turnback;boundary conditions of creep life equations


所属期刊
Materials at High Temperatures
ISSN: 0960-3409
来自:Taylor And Francis