[期刊论文]


Influence of imidazole and benzotriazole on electroless copper plating

作   者:
P. Balaramesh;P. Venkatesh;S. Rekha;

出版年:2014

页     码:552 - 556
出版社:Taylor And Francis


摘   要:

In this study, the effect of imidazole and benzotriazole as primary stabilisers in saccharose and xylitol based copper electroless baths were studied. Copper methane sulphate was used as the complexing agent instead of copper sulphate and para formaldehyde was used as the reducing agent in the bath. The surface morphologies of copper deposits were characterised by SEM, AFM and XRD studies. The electrochemical characteristics were studied by cyclic voltametry to understand the role of the stabilisers in electroless deposition. In the saccharose bath, the imidazole and benzotriazole acted as inhibitors and best deposition was obtained at pH of 12·75. Benzotriazole afforded smoother and shiner deposits than imidazole. In xylitol bath, the stabilizers acted as accelerators and optimum deposition occurred at a pH of 13·25.



关键字:

Copper deposits;Crystal structure;Saccharose;Surface morphology;Xylitol


所属期刊
Surface Engineering
ISSN: 0267-0844
来自:Taylor And Francis