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[期刊论文]
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Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles
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作 者：
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Min-Jung Son;Hyunchang Kim;Seongryul Maeng;Taik-Min Lee;Hoo-Jeong Lee;Inyoung Kim;
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出版年：暂无
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页 码：暂无
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出版社：IOP Publishing
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摘 要：
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暂无
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关键字：
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暂无
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所属期刊
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ISSN:
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来自：IOP Publishing
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