|
[期刊论文]
|
Improvement of electrical and mechanical properties of In-48Sn solder bumps for flexible LED signage using Cu-Ag nanoparticles
|
作 者:
|
Min-Jung Son;Hyunchang Kim;Seongryul Maeng;Taik-Min Lee;Hoo-Jeong Lee;Inyoung Kim;
|
|
出版年:暂无
|
页 码:暂无
|
出版社:IOP Publishing
|
摘 要:
|
暂无
|
关键字:
|
暂无
|
|
|
|
|
|
所属期刊
|
|
|
ISSN:
|
来自:IOP Publishing
|
|